Concepedia
Microelectronics Reliability · 2006 · 91 citations · 2 references
EngineeringManufacturing EngineeringElectronic MaterialsDevice ReliabilityDurabilityHigh-temperature MaterialsReliabilitySemiconductor ReliabilitySolder Joint Residual StressSolderabilityThermal Reliability
2
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 216 citations
Natural Sciences, Materials Engineering, Materials Science +17
Materials and Processes for Implementing High-Temperature Liquid Interconnects
S.H. Mannan, M.P. Clode · IEEE Transactions on Advanced Packaging · 2004 · 57 citations
Natural Sciences, Materials Engineering, Materials Science +15