Concepedia
Microelectronics Reliability · 2006 · 91 citations · 2 references
ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware ReliabilityCircuit ReliabilityThermodynamicsHeat TransferElectronic PackagingThermal EngineeringDevice ReliabilityRefrigeration
2
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 215 citations
Materials Science, Materials Engineering, Sintering +13
Materials and Processes for Implementing High-Temperature Liquid Interconnects
S.H. Mannan, M.P. Clode · IEEE Transactions on Advanced Packaging · 2004 · 57 citations
Liquid Solder Interconnections, Liquid Solder Joints, Engineering +17