An overview of Pb-free, flip-chip wafer-bumping technologies

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

L.P. Lehman, S. N. Athavale, Travis Z. Fullem et al. · Journal of Electronic Materials · 2004 · 171 citations

Natural Sciences, Materials Engineering, Materials Science +14

Low-cost wafer bumping

Peter Gruber, Luc Belanger, G. Brouillette et al. · IBM Journal of Research and Development · 2005 · 49 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Implementing Lead-Free Electronics

Bob Willis · Soldering and Surface Mount Technology · 2005 · 37 citations

Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections

Madhav Datta, R. V. Shenoy, C. Jahnes et al. · Journal of The Electrochemical Society · 1995 · 37 citations

Engineering, Materials Engineering, Materials Science +16

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Sung K. Kang, M. G. Cho, Paul Lauro et al. · Journal of materials research/Pratt's guide to venture capital sources · 2007 · 36 citations

Engineering, Materials Engineering, Materials Science +16