Concepedia

Luc Belanger

LB

Statistics

Publications

3

Citations

110

H-Index

3

Active since

2004

Affiliations

IBM (United States)(Current)

IBM (Canada)

IBM Research - Thomas J. Watson Research Center

Luc Belanger is an author at IBM (United States) specializing in engineering, semiconductor devices, and advanced packaging.

Publications per year

2004–2006

3

Publications

3

Low-cost wafer bumping

Peter Gruber, Luc Belanger, G. Brouillette et al. · IBM Journal of Research and Development · 2005 · 49 citations

, , +17

Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications

M.-C. Paquet, Michael Gaynes, Éric Duchesne et al. · 2006 · 37 citations

, , +17

Injection molded solder technology for Pb-free wafer bumping

Peter Gruber, Da‐Yuan Shih, Luc Belanger et al. · 2004 · 24 citations

, , +9

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