Peter Gruber

Low-cost wafer bumping

Peter Gruber, Luc Belanger, G. Brouillette et al. · IBM Journal of Research and Development · 2005 · 49 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Pb-free solder alloys for flip chip applications

S. K. Kang, Jean Horkans, P. C. Andricacos et al. · 2003 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +15

Injection molded solder technology for Pb-free wafer bumping

Peter Gruber, Da‐Yuan Shih, Luc Belanger et al. · 2004 · 24 citations

Engineering, Materials Engineering, Materials Science +9

Injection molded solder - A new fine pitch substrate bumping method

Jae-Woong Nah, Peter Gruber, Paul Lauro et al. · 2009 · 21 citations

Engineering, Materials Engineering, Materials Science +7

An overview of Pb-free, flip-chip wafer-bumping technologies

Sung K. Kang, Peter Gruber, Da‐Yuan Shih · JOM · 2008 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +12