Statistics
Publications
3
Citations
74
H-Index
3
Active since
2004
Affiliations
IBM (United States)(Current)
Éric Duchesne is an author at IBM (United States) specializing in materials science, integrated circuit fabrication, and semiconductor devices.
Publications per year
2004–2022
3
3
Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology
W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations
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