Papa Momar Souaré

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Active since

2014

Affiliations

Université Grenoble Alpes(Current)

Université de Sherbrooke

Laboratoire d'Électronique des Technologies de l'Information

STMicroelectronics (France)

Institut interdisciplinaire d'innovation technologique

Papa Momar Souaré is an author at Université Grenoble Alpes specializing in thermal effects in integrated circuits, 3d integrated circuits, and engineering.

Publications per year

2014–2022

Publications

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

P. Coudrain, Papa Momar Souaré, Vincent Fiori et al. · IEEE Design and Test · 2015 · 18 citations

Engineering, Computer Engineering, Electrical Engineering +17

Using Confocal Microscopy and Digital Image Correlation to Measure Local Strains Around a Chip Corner and a Crack Front

Ying Yang, Papa Momar Souaré, Julien Sylvestre · IEEE Transactions on Device and Materials Reliability · 2019 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal and mechanical analysis of a concentrated photovoltaic module with integrated secondary optics

Papa Momar Souaré, Julien Sylvestre · AIP conference proceedings · 2016 · 12 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables

Ying Yang, Mamadou Kabirou Touré, Papa Momar Souaré et al. · Microelectronics Reliability · 2022 · 12 citations

Engineering, Manufacturing Engineering, Materials Engineering +14

Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations

Papa Momar Souaré, Vincent Fiori, A. Farcy et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 11 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

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