Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

Surface Chemistry for Atomic Layer Growth

Steven M. George, A. W. Ott, J. W. Klaus · The Journal of Physical Chemistry · 1996 · 676 citations

Natural Sciences, Chemistry, Materials Science +17

Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

Alain E. Kaloyeros, Eric Eisenbraun · Annual Review of Materials Science · 2000 · 362 citations

Natural Sciences, Materials Engineering, Materials Science +17

Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si

Mei‐Hui Tsai, Shuo Sun, C.E. Tsai et al. · Journal of Applied Physics · 1996 · 174 citations

Natural Sciences, Materials Engineering, Materials Science +17

Chemical vapor deposition of vanadium, niobium, and tantalum nitride thin films

Renaud M. Fix, Roy G. Gordon, David M. Hoffman · Chemistry of Materials · 1993 · 170 citations

Natural Sciences, Chemistry, Materials Science +15

Stress-Induced Phenomena In Metallization

Paul S. Ho · 1994 · 159 citations

Natural Sciences, Electrical Engineering, Materials Science +17