O. van der Straten

Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition

H. Kim, C. Detavenier, O. van der Straten et al. · Journal of Applied Physics · 2005 · 105 citations

Natural Sciences, Materials Engineering, Materials Science +17

A 14 nm Embedded STT-MRAM CMOS Technology

D. Edelstein, Michael Rizzolo, Devika Sil et al. · 2020 · 58 citations

Engineering, Computer Engineering, Electrical Engineering +16

Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

Nicholas A. Lanzillo, K. Choi, C.-C. Yang et al. · IEEE Electron Device Letters · 2019 · 47 citations

Engineering, Electrical Engineering, Materials Science +17

Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

O. van der Straten, Yu Zhu, Kathleen Dunn et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +17

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +15