2008 · 24 citations · 11 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ModelingHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMicrowave Semiconductor DevicesThermal ManagementThermal Properties Of SemiconductorsHigh-frequency ElectronicsHigh-frequency OperationHigh-temperature Device OperationHigh-temperature ElectronicsThermal Effects In Integrated CircuitsThermal Effects In Microwave DevicesThermal Management In High-frequency DevicesThermal Management Of Semiconductor Devices
This paper presents the results of investigations on process thermal budget reduction in order to increase the operation frequency of SiGe HBTs. We describe the variations of DC and AC characteristics of the devices with the spike annealing temperature. Record peak f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> values of 410 GHz and 640 GHz are reported at room and cryogenic temperatures respectively.
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Half-terahertz operation of SiGe HBTs
R. Krithivasan, Yuan Lu, John D. Cressler et al. · IEEE Electron Device Letters · 2006 · 101 citations
William Snodgrass, W. Hafez, N.E. Harff et al. · 2006 · 53 citations
A low-parasitic collector construction for high-speed SiGe:C HBTs
B. Heinemann, R. Barth, D. Bolze et al. · 2005 · 44 citations
High-Speed SiGe BiCMOS Technologies: 120-nm Status and End-of-Roadmap Challenges
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