A Generic Environment-Resistant Packaging Technology for MEMS

Abstract

This paper presents a new generic MEMS packaging technology for thermal and vibration isolation of a MEMS device using an isolation platform crab-leg shaped isolation suspension beams, fabricated from a 100μm-thick glass wafer. The packaging technology is both hermetic and vacuum compatible to pressures <10mTorr, and it provides vertical feedthroughs for signal transfer. A new and generic MEMS die transfer/assembly technique is also developed that can handle a wide variety of individual MEMS chips or wafers, in either a hybrid or integrated fashion. A silicon die with a heater and temperature sensor was fabricated, transferred, and packaged to demonstrate the feasibility of the proposed method. A measured thermal impedance of 3000K/W and feedthrough contact resistance of less than 2Ω has been demonstrated with this package.