Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS

TLDR

MEMS and MOEMS have advanced rapidly, yet packaging and assembly techniques have lagged, making packaging a costly and failure‑prone component of microsystem manufacturing. The paper aims to tackle packaging and assembly challenges for MEMS and MOEMS across various applications. It reviews hermetic and vacuum micropackaging, wafer‑level packaging and bonding, and miniature sealed interconnection and feedthrough technologies. It discusses results from long‑term accelerated testing and in‑situ tests, particularly in biological hosts.

Abstract

Although MEMS technologies and device structures have made significant progress in the past three decades and have found widespread application in many areas, including Micro-Opto-Electro-Mechanical Systems (MOEMS), packaging and assembly techniques suitable for many of these emerging applications have not kept pace. Packaging is one of the most costly parts of microsystem manufacturing, and it is also often the first to fail or negatively influence the system response. This paper addresses the packaging and assembly challenges of microsystems and MEMS for different applications. Hermetic and vacuum micropackaging, wafer-level packaging and bonding, and miniature sealed interconnection and feedthrough technologies will be reviewed. Results from long-term accelerated testing, and from in-situ tests, especially in biological hosts, will also be discussed. Issues and challenges facing packaging of MOEMS will be discussed.