Concepedia

W. Weich

WW

1

Publications

28

Citations

1

H-Index

2005

Active since

Affiliations

University of Michigan(Current)

W. Weich is an author at University of Michigan specializing in engineering, electronic packaging, and microfabrication.

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Publications per year

2005–2005

1

Publications

1

Transient liquid phase (TLP) bonding for microsystem packaging applications

W. Weich, Junseok Chae, Sanghyun Lee et al. · 2005 · 28 citations

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