Concepedia

High speed Cu-Ni filling into TSV for 3-Dimensional Si chip stacking

Sung Chul Hong, Santosh Kumar, Do Hyun Jung, Won Joong Kim, Jae Pil Jung

Metals and Materials International · 2013 · 20 citations · 16 references

Concepts

EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesChip PackagingIntegrated Circuit DesignIntegrated Circuit FabricationPhysical DesignVery-large-scale Integration Layout3D Integrated CircuitsThree-dimensional Integrated Circuit LayoutThree-dimensional Integration

References

16

Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

Wei‐Ping Dow, Ming-Yao Yen, Wen-Bing Lin et al. · Journal of The Electrochemical Society · 2005 · 195 citations

Natural Sciences, Materials Engineering, Materials Science +16

Through silicon via copper electrodeposition for 3D integration

Rozalia Beica, Charles Sharbono, Tom Ritzdorf · 2008 · 126 citations

Engineering, Materials Engineering, Materials Science +17

Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

Leila Ladani · Microelectronic Engineering · 2009 · 118 citations

Engineering, Electrical Engineering, Materials Engineering +17

Via-filling using electroplating for build-up PCBs

Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara et al. · Electrochimica Acta · 2001 · 115 citations

Engineering, Materials Engineering, Materials Science +6

Two-step room temperature grain growth in electroplated copper

Sywert Brongersma, E. Richard, I. Vervoort et al. · Journal of Applied Physics · 1999 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +17