Ming-Yao Yen

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Publications

Citations

1.1K

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Active since

2005

Affiliations

National Yunlin University of Science and Technology(Current)

National Chung Hsing University

Ming-Yao Yen is an author at National Yunlin University of Science and Technology specializing in materials science, materials engineering, and electroplating.

Publications per year

2005–2013

Publications

Influence of Convection-Dependent Adsorption of Additives on Microvia Filling by Copper Electroplating

Wei‐Ping Dow, Her-Shu Huang, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2005 · 208 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

Wei‐Ping Dow, Ming-Yao Yen, Wen-Bing Lin et al. · Journal of The Electrochemical Society · 2005 · 195 citations

Natural Sciences, Materials Engineering, Materials Science +16

Filling mechanism in microvia metallization by copper electroplating

Wei‐Ping Dow, Ming-Yao Yen, Sian-Zong Liao et al. · Electrochimica Acta · 2008 · 129 citations

Engineering, Materials Engineering, Materials Science +14

Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition

Wei‐Ping Dow, Her-Shu Huang, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2005 · 127 citations

Natural Sciences, Chemistry, Materials Science +17

Through-Hole Filling by Copper Electroplating

Wei‐Ping Dow, Hsiang‐Hao Chen, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2008 · 102 citations

Engineering, Materials Engineering, Materials Science +11

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