Hsiang‐Hao Chen

Statistics

Publications

Citations

276

H-Index

Active since

2004

Affiliations

National Yunlin University of Science and Technology(Current)

Hsiang‐Hao Chen is an author at National Yunlin University of Science and Technology specializing in materials science, integrated circuit fabrication, and engineering.

Publications per year

2004–2008

Publications

Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition

Wei‐Ping Dow, Her-Shu Huang, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2005 · 127 citations

Natural Sciences, Chemistry, Materials Science +17

Through-Hole Filling by Copper Electroplating

Wei‐Ping Dow, Hsiang‐Hao Chen, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2008 · 102 citations

Engineering, Materials Engineering, Materials Science +11

A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Wei‐Ping Dow, Hsiang‐Hao Chen · Circuit World · 2004 · 34 citations

Engineering, Materials Engineering, Materials Science +11

Simultaneous Filling of Microvia and Through Hole by Copper Electroplating for High Density Interconnection of PCB

Wei‐Ping Dow, Hsiang‐Hao Chen, Ming-Yao Yen et al. · ECS Transactions · 2007 · 13 citations

Engineering, Electrical Engineering, Materials Science +15

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