A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Abstract

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.