Concepedia

Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

Microelectronic Engineering · 2009 · 113 citations · 16 references

Concepts

Numerical AnalysisThermo-mechanical ReliabilityElectrical Engineering3D Ic ArchitectureEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityMechanical EngineeringSilicon Vias3D IntegrationSolid MechanicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringMechanics Of MaterialsInterconnect (Integrated Circuits)Device Reliability

References

16

<i>Fundamentals of Creep and Creep-Rupture in Metals</i>

F. Garofalo, Daniel B. Butrymowicz · Physics Today · 1966 · 880 citations

Materials Science, Engineering, Severe Plastic Deformation +3

Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

W. Engelmaier · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 356 citations

Fatigue Life, Electrical Engineering, Engineering +10

The physical properties of composite materials

D. K. Hale · Journal of Materials Science · 1976 · 311 citations

Materials Science, Composites, Engineering +3

The physical properties of composite materials

D. K. Hale · Journal of Materials Science · 1976 · 278 citations

Materials Science, Composites, Engineering +3

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 119 citations

Engineering, Radio Frequency, Integrated Circuits +18