Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material

Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-<i>k</i> to extreme low-<i>k</i> interconnect materials

A. Grill · Journal of Applied Physics · 2003 · 245 citations

Materials Science, Plasma Electronics, Dielectric Constant +15

Preparation and structure of porous dielectrics by plasma enhanced chemical vapor deposition

S. M. Gates, D. Neumayer, Mark Sherwood et al. · Journal of Applied Physics · 2007 · 87 citations

Psicoh Film, Engineering, Nanoporous Material +18

Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas

N. Possémé, T. Chevolleau, Maxime Darnon et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2007 · 78 citations · Full text

Engineering, Nanoporous Material, Oxidation Resistance +16

Pore Sealing by NH[sub 3] Plasma Treatment of Porous Low Dielectric Constant Films

Hua-Gen Peng, Dong-Zhi Chi, W.D. Wang et al. · Journal of The Electrochemical Society · 2007 · 33 citations

Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy · Thin Solid Films · 2004 · 31 citations

Materials Science, Electrical Engineering, Electromigration Technique +9