Jun-Fu Huang

Effect of moisture on electrical properties and reliability of low dielectric constant materials

Yi-Lung Cheng, Ka-Wai Leon, Jun-Fu Huang et al. · Microelectronic Engineering · 2013 · 52 citations

Materials Science, Materials Engineering, Electrical Engineering +9

Modeling Sub-90nm On-Chip Variation Using Monte Carlo Method for DFM

Jun-Fu Huang, Victor C. Y. Chang, Sally Liu et al. · 2007 · 20 citations

Random On-chip Variation, Engineering, Vlsi Design +16

Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics

Yu‐Min Chang, Wei-Yuan Chang, Jun-Fu Huang et al. · Thin Solid Films · 2012 · 20 citations

Materials Science, Thermal Treatment, Electrical Engineering +10

Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material

Yi-Lung Cheng, Jun-Fu Huang, Yu‐Min Chang et al. · Thin Solid Films · 2012 · 14 citations

Materials Science, Electrical Engineering, Engineering +5

Direct plating of Cu on ALD TaN for 45nm-node Cu BEOL metallization

Chun-Hsing Shih, H.W. Su, C.J. Lin et al. · 2005 · 10 citations