Influences of the moisture absorption on PBGA package’s warpage during IR reflow process - Concepedia

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Influences of the moisture absorption on PBGA package’s warpage during IR reflow process

20

Citations

14

References

2003

Year

Chi‐Hui Chien, Yung‐Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Weizhi Chen, Yii-Der Wu

Microelectronics Reliability

Materials ScienceAdvanced PackagingEngineeringElectronic PackagingMoisture Absorption

References

	Year	Citations

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