Concepedia

Thaiping Chen

TC

4

Publications

261

Citations

4

H-Index

2003

Active since

Affiliations

Fortune Institute of Technology(Current)

National Sun Yat-sen University

R.O.C Military Academy

Thaiping Chen is an author at Fortune Institute of Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMicrostructureSurface ScienceMicroelectronicsMicrofabricationAdvanced PackagingMechanical Systems

Publications per year

2003–2011

4

Publications

4

Process parameters study on FSW joint of dissimilar metals for aluminum–steel

Thaiping Chen · Journal of Materials Science · 2009 · 159 citations

Materials Science, Engineering, Process Parameters +5

Optimal FSW process parameters for aluminum alloys AA5083

Chi‐Hui Chien, Wei-Bang Lin, Thaiping Chen · Journal of the Chinese Institute of Engineers · 2011 · 70 citations

Friction Welding, Engineering, Industrial Engineering +12

Influences of the moisture absorption on PBGA package’s warpage during IR reflow process

Chi‐Hui Chien, Yung‐Chang Chen, Yii-Tay Chiou et al. · Microelectronics Reliability · 2003 · 20 citations

Materials Science, Advanced Packaging, Engineering +2

Experimental and statistical study in adhesion features of bonded interfaces of IC packages

Chi‐Hui Chien, Thaiping Chen, Wei-Bang Lin et al. · Microelectronics Reliability · 2007 · 12 citations

Materials Science, Chip-scale Package, Engineering +12

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