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Experimental and statistical study in adhesion features of bonded interfaces of IC packages

Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationBonded InterfacesMechanical EngineeringSurface ScienceAdhesive MaterialAdhesion FeaturesChip AttachmentElectronic PackagingMicroelectronicsIc PackagesStructural Adhesive