Expanding thermal plasma for low-k dielectrics: engineering the film chemistry by means of specific dissociation paths in the plasma

Low dielectric constant materials for microelectronics

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Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-<i>k</i> to extreme low-<i>k</i> interconnect materials

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Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from tetramethylsilane

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Plasma chemistry aspects of a-Si:H deposition using an expanding thermal plasma

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Origin of low dielectric constant of carbon-incorporated silicon oxide film deposited by plasma enhanced chemical vapor deposition

Jin Yong Kim, Moo Sung Hwang, Yoon-Hae Kim et al. · Journal of Applied Physics · 2001 · 104 citations

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