Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate

Daquan Yu, Hong‐Bin Xie, Lu Wang · Journal of Alloys and Compounds · 2004 · 136 citations

Natural Sciences, Materials Engineering, Materials Science +11

Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy

Sourav Das, Ahmed Sharif, Y.C. Chan et al. · Journal of Alloys and Compounds · 2009 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +14