Henggang Yin

Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys

Jun Shen, Yayun Pu, Henggang Yin et al. · Journal of Alloys and Compounds · 2014 · 142 citations

Materials Science, Materials Engineering, Engineering +9

Modeling of mechanical behavior of corroded X80 steel pipeline reinforced with type-B repair sleeve

Yi Shuai, Xinhua Wang, Junqiang Wang et al. · Thin-Walled Structures · 2021 · 42 citations

Engineering, Corrosion, Mechanical Behavior +8

Local buckling failure analysis of high strength pipelines containing a plain dent under bending moment

Yi Shuai, Daochuan Zhou, Xinhua Wang et al. · Journal of Natural Gas Science and Engineering · 2020 · 38 citations

Engineering, Plain Dent, Mechanical Engineering +8

Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders

Jun Shen, Yayun Pu, Henggang Yin et al. · Journal of Electronic Materials · 2014 · 25 citations

Materials Science, Materials Engineering, Engineering +11

Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints

Changfei Peng, Jun Shen, Henggang Yin · Journal of Materials Science Materials in Electronics · 2012 · 13 citations

Materials Science, Materials Engineering, Engineering +8