Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 20 citations · 18 references
EngineeringManufacturing EngineeringElectronic MaterialsMicrofabricationSemiconductor DevicesDesign For TestabilityIntegrated Circuit DesignIntegrated Circuit FabricationSelf-assembled MaterialsSelf-assemblyChannel DegradationDirected Self-assemblyFin DesignMicrofabrication Process IntegrationSelf-assembled Electronic StructuresThermodynamic Equilibrium
The first fully integrated SOI device using 42nm-pitch directed self-assembly (DSA) process for fin formation has been demonstrated in a 300mm pilot line environment. Two major issues were observed and resolved in the fin formation process. The cause of the issues and process optimization are discussed. The DSA device shows comparable yield with slight short channel degradation which is a result of a large fin CD when compared to the devices made by baseline process. LER/LWR analysis through the DSA process implied that the 42nm-pitch DSA process may not have reached the thermodynamic equilibrium. Here, we also show preliminary results from using scatterometry to detect DSA defects before removing one of the blocks in BCP.
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