Measurement and analysis of contact resistance in wafer probe testing

A micromachined array probe card-characterization

M. Beiley, J. Leung, S.S. Wong · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 48 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of fritting phenomena on Al electrode for low contact force probe card

Kyoko S. Kataoka, Toshihiro Itoh, Tadatomo Suga · IEEE Transactions on Components and Packaging Technologies · 2003 · 24 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Probe contact resistance variations during elevated temperature wafer test

Jan Brož, R.M. Rincon · 2003 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +16

Highly reliable probe card for wafer testing

Shoji Maekawa, M. Takemoto, Yoshihiro Kashiba et al. · 2002 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Low contact force probing on copper electrodes

Kyoko S. Kataoka, Toshihiro Itoh, Ken-ichi Okumura et al. · 2003 · 16 citations

Natural Sciences, Electrical Engineering, Materials Science +14