D.S. Liu

Experimental method and FE simulation model for evaluation of wafer probing parameters

D.S. Liu, Meng-Kai Shih · Microelectronics Journal · 2006 · 25 citations

Engineering, Computational Engineering, Manufacturing Engineering +17

PRACTICAL EVALUATION FOR LONG-TERM STABILITY OF THERMAL INTERFACE MATERIAL

Chaomiao Chen, Chudi Ni, H.Y. Pan et al. · Experimental Techniques · 2008 · 22 citations

Engineering, Materials Engineering, Materials Science +10

Relationship between medial plica and medial femoral condyle—a three-dimensional dynamic finite element model

D.S. Liu, Zhen-Wei Zhuang, Shaw‐Ruey Lyu · Clinical Biomechanics · 2013 · 20 citations

Medicine, Orthopaedic Surgery, Orthopedic Surgery +16

Measurement and analysis of contact resistance in wafer probe testing

D.S. Liu, Meng-Kai Shih, W.H. Huang · Microelectronics Reliability · 2006 · 19 citations

Engineering, Electrical Engineering, Materials Science +14

An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design

D.S. Liu, Meng-Kai Shih · IEEE Transactions on Electronics Packaging Manufacturing · 2006 · 18 citations

Engineering, Electrical Engineering, Mechanical Engineering +17