IEEE Transactions on Instrumentation and Measurement · 2014 · 15 citations · 15 references
EngineeringElectrical EngineeringManufacturing EngineeringMicroelectronicsMicrofabricationMicrowave EngineeringDesign For TestabilityDevice CharacterizationIntegrated Circuit DesignMems CharacterizationMems TestingRf MemsContact ResistanceContact Resistance MeasurementElectrical Testing Of Mems DevicesHigh-frequency CharacterizationInsertion LossInterconnect TestingOn-wafer Measurement TechniquesReturn Loss
Multichannel die probing increases test speed and lowers the overall cost of testing. A new high-density wafer probe card based on MEMS technology is presented in this paper. MEMS-based microtest-channels have been designed to establish high-speed low-resistance connectivity between the die-under-test and the tester at the wafer level. The proposed test scheme can be used to probe fine pitch pads and interconnects of a new generation of 3-D integrated circuits. The proposed MEMS probe, which is fabricated with two masks, supports \(10^{6}\) lifetime touchdowns. Measurement results using a prototype indicate that the proposed architecture can be used to conduct manufacturing tests up to 38.6 GHz with less than -1-dB insertion loss while maintaining 11.4-m\(\Omega \) contact resistance. The measured return loss of the probe at 39.6 GHz is -12.05 dB.
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Evaluation of TSV and micro-bump probing for wide I/O testing
Ken R. Smith, Peter Hanaway, Mike Jolley et al. · 2011 · 57 citations
Engineering, Electrical Engineering, Mechanical Engineering +14