Resist Flow Behavior in Ultraviolet Nanoimprint Lithography as a Function of Contact Angle with Stamp and Substrate

Abstract

This study was performed to investigate dynamic resist filling in ultraviolet nanoimprint lithography. The effects of surface condition on flow behavior during the filling process, including the contact angle and the aspect ratio of recessed features, are presented through numerical simulations. The optimized surface conditions for good imprinting results were determined through numerical experiments covering a range of test conditions. A decrease in the feature aspect ratio of up to 0.5 resulted in a contact angle twice the original value. Complete filling occurred when the contact angle of the vertical side wall was as low as that of the substrate.