Wire-bonding process development for low-k materials

New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al

C.D. Breach, F. Wulff · Microelectronics Reliability · 2004 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +13

Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Caroline M. Whelan, Michael Kinsella, L. Carbonell et al. · Microelectronic Engineering · 2003 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules

A. Hamidi, N. Beck, E. Herr · Microelectronics Reliability · 1999 · 95 citations

Engineering, Electrical Engineering, Materials Science +16

Integration challenges of porous ultra low-k spin-on dielectrics

K. Mosig, T. Jacobs, K. Brennan et al. · Microelectronic Engineering · 2002 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +13

Wire bonding to advanced copper, low-K integrated circuits, the metal/dielectric stacks, and materials considerations

G. G. Harman, Chloe Johnson · IEEE Transactions on Components and Packaging Technologies · 2002 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +17