Hong Meng Ho

Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Caroline M. Whelan, Michael Kinsella, L. Carbonell et al. · Microelectronic Engineering · 2003 · 109 citations

Materials Science, Corrosion Protection, Engineering +7

Corrosion Inhibition by Thiol-Derived SAMs for Enhanced Wire Bonding on Cu Surfaces

Caroline M. Whelan, Michael Kinsella, Hong Meng Ho et al. · Journal of The Electrochemical Society · 2004 · 55 citations

Engineering, Surface Nanotechnology, Chemistry +17

Direct gold and copper wires bonding on copper

Hong Meng Ho, Wai Lam, Serguei Stoukatch et al. · Microelectronics Reliability · 2003 · 42 citations

Materials Engineering, Materials Science, Engineering +6

Modeling Energy Transfer to Copper Wire for Bonding in an Inert Environment

Hong Meng Ho, Jiakun Tan, Yee Chen Tan et al. · 2006 · 18 citations

Materials Science, Materials Engineering, Electrical Engineering +13

In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding

Caroline M. Whelan, Michael Kinsella, Hong Meng Ho et al. · Journal of Electronic Materials · 2004 · 17 citations

Materials Science, Engineering, Surface Chemistry +9