B.H.W. Toh

Study of factors affecting the hardness of ball bonds in copper wire bonding

Z.W. Zhong, Huey-Lin Ho, Yee Chen Tan et al. · Microelectronic Engineering · 2006 · 59 citations

Materials Science, Materials Engineering, Engineering +10

Modelling of free air ball for copper wire bonding

Jiakun Tan, B.H.W. Toh, Hong Meng Ho · 2005 · 27 citations

Engineering, Mechanical Engineering, Copper Wire +17

Modeling Energy Transfer to Copper Wire for Bonding in an Inert Environment

Hong Meng Ho, Jiakun Tan, Yee Chen Tan et al. · 2006 · 18 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology

P.J. McNally, J. Kanatharana, B.H.W. Toh et al. · Journal of Applied Physics · 2004 · 10 citations · Full text

Exponential Distribution, Engineering, Severe Plastic Deformation +21