Bonding Process Optimization

Bonding Process Optimization is a systematic methodology within wafer bonding technology that refines process parameters and conditions to achieve maximum bond quality, yield, and reliability while minimizing defects and thermal budget.

151

Publications

4.5K

Citations

670

Authors

180

Institutions

Publications per year

2017–2026

Parents

Wafer Bonding

Publications

151

Investigation of the parameters of the cold roll bonding (CRB) process

Roohollah Jamaati, Mohammad Reza Toroghinejad · Materials Science and Engineering A · 2009 · 175 citations

Engineering, Materials Engineering, Materials Science +5

An improved anodic bonding process using pulsed voltage technique

Thomas M. H. Lee, I‐Ming Hsing, Connie Y.N Liaw · Journal of Microelectromechanical Systems · 2000 · 157 citations

Engineering, Materials Engineering, Materials Science +14

35.8% space and 38.8% terrestrial 5J direct bonded cells

Philip Chiu, D. C. Law, R.L. Woo et al. · 2014 · 149 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of low-temperature wafer bonding using thin-film parylene

H. Kim, K. Najafi · Journal of Microelectromechanical Systems · 2005 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +17

Adhesive Bonding of InP∕InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene

Günther Roelkens, Joost Brouckaert, Dries Van Thourhout et al. · Journal of The Electrochemical Society · 2006 · 131 citations · Full text

Engineering, Materials Engineering, Materials Science +17

1–5 of 151

Authors

670

MM
M. Mayer
University of Waterloo, Canada
6 publications · 112 citations
6
h-index
HM
Hong Meng Ho
IMEC, Belgium
3 publications · 58 citations
3
h-index
EB
Eric Beyne
IMEC, Belgium
3 publications · 40 citations
3
h-index
TH
Tung‐Hsu Hou
National Yunlin University of Science and Technology, Taiwan
3 publications · 96 citations
3
h-index
YZ
Y. Zhou
University of Waterloo, Canada
3 publications · 58 citations
3
h-index

1–5 of 670

Institutions

180

1–8 of 180

Venues

Microelectronics Reliability
7 publications · 154 citations
7
h-index
IEEE Transactions on Components Hybrids and Manufacturing Technology
4 publications · 138 citations
4
h-index
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Conference · 4 publications · 101 citations
4
h-index
Optics & Laser Technology
4 publications · 122 citations
4
h-index
Journal of Micromechanics and Microengineering
JMM · 3 publications · 38 citations
3
h-index

1–5