Concepedia

Connie Y.N Liaw

CY

Statistics

Publications

2

Citations

255

H-Index

2

Active since

2000

Affiliations

Hong Kong University of Science and Technology(Current)

Connie Y.N Liaw is an author at Hong Kong University of Science and Technology specializing in microfabrication, engineering, and electronic packaging.

Top concepts

Publications per year

2000–2000

2

Publications

2

An improved anodic bonding process using pulsed voltage technique

Thomas M. H. Lee, I‐Ming Hsing, Connie Y.N Liaw · Journal of Microelectromechanical Systems · 2000 · 156 citations

, , +14

Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates

Thomas M. H. Lee, Debbie H.Y Lee, Connie Y.N Liaw et al. · Sensors and Actuators A Physical · 2000 · 99 citations

, , +8

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