Concepedia

G. G. Harman

GG

9

Publications

420

Citations

9

H-Index

1956

Active since

Affiliations

National Institute of Standards and Technology(Current)

G. G. Harman is an author at National Institute of Standards and Technology specializing in engineering, applied physics, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingMechanical EngineeringMicroelectronicsUltrasoundMicrostructureMaterials EngineeringElectrical Engineering

Publications per year

1956–2023

9

Publications

9

The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics

G. G. Harman, John Albers · IEEE Transactions on Parts Hybrids and Packaging · 1977 · 201 citations

Friction Welding, Engineering, Gold Ultrasonic Bonding +18

Wire bonding to advanced copper, low-K integrated circuits, the metal/dielectric stacks, and materials considerations

G. G. Harman, Chloe Johnson · IEEE Transactions on Components and Packaging Technologies · 2002 · 70 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

The Microelectronic Wire Bond Pull Test-How to use It, How to Abuse It

G. G. Harman, Colin P. Cannon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1978 · 50 citations

Electrical Engineering, Engineering, Bond Pull Test +4

Wire-bonding process monitoring using thermopile temperature sensor

Shivesh K. Suman, Michael Gaitan, Yogendra Joshi et al. · IEEE Transactions on Advanced Packaging · 2005 · 35 citations

Materials Science, Bond Pad Interface, Engineering +14

High-Frequency-Induced Electroluminescence in ZnS

G. G. Harman, R. L. Raybold · Physical Review · 1956 · 16 citations

Optical Materials, Engineering, Solid-state Lighting +13

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