Influence of top surface passivation on bottom-channel hole mobility of ultrathin SiGe- and Ge-on-insulator

Abstract

Bottom-channel hole mobility was examined by a pseudo-metal-oxide-semiconductor field-effect transistors method for ultrathin SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI), which were fabricated using Ge condensation by dry oxidation. By comparing samples with and without a top SiO2 layer, we investigated the influence of top surface passivation on bottom-channel hole mobility. Mobility degradation was found in an ultrathin SGOI/GOI layer without top SiO2 and became more serious with a decrease in the thickness of the SGOI/GOI layer, which strongly suggested that top surface passivation is necessary to evaluate accurate channel mobility. A 13-nm-thick GOI with passivation showed a high mobility value of 440 cm2/V s.