Materials science forum · 2008 · 55 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsPower ElectronicsSemiconductor DevicesDevice CharacterizationSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBlockingCharge Carrier DensityConduction BandFixed Charge DensityInterface Trap DensityPositive Temperature CoefficientSilicon CarbideSilicon Carbide Power Devices
For the first time, high power 4H-SiC n-IGBTs have been demonstrated with 13 kV blocking and a low Rdiff,on of 22 mWcm2 which surpasses the 4H-SiC material limit for unipolar devices. Normally-off operation and >10 kV blocking is maintained up to 200oC base plate temperature. The on-state resistance has a slight positive temperature coefficient which makes the n-IGBT attractive for parallel configurations. MOS characterization reveals a low net positive fixed charge density in the oxide and a low interface trap density near the conduction band which produces a 3 V threshold and a peak channel mobility of 18 cm2/Vs in the lateral MOSFET test structure. Finally, encouraging device yields of 64% in the on-state and 27% in the blocking indicate that the 4H-SiC n-IGBT may eventually become a viable power device technology.