2006 · 16 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDevice ReliabilitySemiconductor HeterostructuresSemiconductor PhysicsSemiconductor ReliabilityWide Band Gap SemiconductorsWide-bandgap SemiconductorsConductionElectron TunnelingElectronic ConductionGallium NitrideGallium Nitride (Gan) MaterialsGallium Nitride Power DevicesPower OutputReliability Degradation
High voltage HFET's fabricated from nitride semiconductors utilizing the AlGaN/GaN heterojunction demonstrate excellent RF performance with RF output power greater than an order of magnitude higher than available from GaAs and InP based devices. However, the nitride devices demonstrate a reliability problem where the dc current and RF output power continually decrease as a function of time. The reliability problem is related to the conduction characteristics of the gate electrode and an electron tunneling mechanism where electrons leak from the gate to the surface of the semiconductor. In this work the physics responsible for this behavior are investigated and described
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Gate breakdown in MESFETs and HEMTs
R.J. Trew, Umesh K. Mishra · IEEE Electron Device Letters · 1991 · 89 citations
Engineering, Electrical Engineering, Electronic Materials +15
Wide bandgap semiconductor devices and MMICs for RF power applications
John W. Palmour, S.T. Sheppard, R.P. Smith et al. · 2002 · 79 citations
An over 200-W output power GaN HEMT push-pull amplifier with high reliability
T. Kikkawa, Toru Maniwa, Hiroyuki Hayashi et al. · 2004 · 71 citations