IEEE Transactions on Electron Devices · 1999 · 21 citations · 15 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice CharacterizationDevice ModelingMetal-oxide-semiconductor Field-effect TransistorsWide Band Gap SemiconductorsAspect Ratio DesignBreakdown VoltageChannel Doping EffectsDoping Profile AnalysisGate-dependent Current-voltage BehaviorHigh-voltage BreakdownMosfet Modeling
The effect of gate recess profile on device performance of Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FETs was studied. In the experiment, Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FETs (DCFET's) using triple-recessed gate structure were compared with devices using single-recessed and double-recessed gate structures. It is found that triple-recessed gate approach provides higher breakdown voltage (35 V) than single-recessed (16 V) and double-recessed gate (28 V) approaches. This is attributed to the larger aspect ratio in the triple-recessed gate structure. A unified method to calculate the breakdown voltages of MESFETs, HEMTs and DCFETs (or MISFETs) of any given arbitrary recessed gate profile was proposed and used to explain the experimental results.
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Control of gate—Drain avalanche in GaAs MESFET's
S. H. Wemple, W.C. Niehaus, H. M. Cox et al. · IEEE Transactions on Electron Devices · 1980 · 130 citations
High reliability InGaP/GaAs HBT
N. Pan, J. Elliott, Matthew Knowles et al. · IEEE Electron Device Letters · 1998 · 78 citations