A new fabrication method for low stress PECVD - SiN_xlayers

Stress investigation of PECVD dielectric layers for advanced optical MEMS

A. Tarraf, J. Daleiden, S. Irmer et al. · Journal of Micromechanics and Microengineering · 2003 · 121 citations

Detailed Stress Investigations, Optical Materials, Engineering +23

Mechanism of SiN<i>x</i>H<i>y</i> deposition from N2–SiH4 plasma

Donald L. Smith, Andrew S. Alimonda, Frederick J. von Preissig · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1990 · 87 citations

Engineering, Glow Discharge, Deposition Electrode +18

Plasma-enhanced CVD: Oxides, nitrides, transition metals, and transition metal silicides

Dennis W. Hess · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1984 · 81 citations

Materials Science, Chemical Engineering, Engineering +14

Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry–Pérot optical filters

Han Huang, K.J. Winchester, Yinong Liu et al. · Journal of Micromechanics and Microengineering · 2005 · 73 citations

Intrinsic Stress Gradient, Optical Materials, Engineering +20

Water and oxygen permeation of silicon nitride films prepared by plasma-enhanced chemical vapor deposition

Dong‐Sing Wuu, W.C. Lo, C. C. Chiang et al. · Surface and Coatings Technology · 2004 · 61 citations

Materials Science, Chemical Engineering, Engineering +8