BCB-to-oxide bonding technology for 3D integration

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 457 citations

Engineering, Mechanical Engineering, Biomedical Engineering +16

Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration

Frank Niklaus, Ravi Kumar, J. J. McMahon et al. · Journal of The Electrochemical Society · 2006 · 80 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Low temperature silicon direct bonding for application in micromechanics: bonding energies for different combinations of oxides

Gertrud Kräuter, Andreas Schumacher, U. Gösele · Sensors and Actuators A Physical · 1998 · 65 citations

Materials Science, Materials Engineering, Wafer Scale Processing +10

Exploring compromises among timing, power and temperature in three-dimensional integrated circuits

Hua Hao, Chris Mineo, Kory Michael Schoenfliess et al. · 2006 · 42 citations

Engineering, Vlsi Design, Energy Efficiency +20

Electrically yielding Collective Hybrid Bonding for 3D stacking of ICs

Anne Jourdain, Philippe Soussan, Bart Swinnen et al. · 2009 · 35 citations

Engineering, Mechanical Engineering, Die Pick +19