Concepedia

C. T. Ko

CT

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Publications

3

Citations

113

H-Index

3

Active since

2011

Affiliations

National Yang Ming Chiao Tung University(Current)

C. T. Ko is an author at National Yang Ming Chiao Tung University specializing in 3d printing, microelectronics, and engineering.

Top concepts

Publications per year

2011–2018

3

Publications

3

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 91 citations

, , +15

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies

C. T. Ko, Z. C. Hsiao, Y. J. Chang et al. · 2012 · 12 citations

, , +17

BCB-to-oxide bonding technology for 3D integration

S.L. Lin, Wen‐Chun Huang, C. T. Ko et al. · Microelectronics Reliability · 2011 · 10 citations

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