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Low temperature silicon direct bonding for application in micromechanics: bonding energies for different combinations of oxides

Materials ScienceMaterials EngineeringWafer Scale ProcessingEngineeringMicrofabricationApplied PhysicsChip AttachmentSemiconductor Device FabricationDifferent CombinationsSilicon On InsulatorMicroelectronicsMicro-electromechanical SystemBonding Energies