Filling of very deep, wide trenches by BenzoCycloButene polymer

Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material

Michael E. Mills, P. H. Townsend, Dan Castillo et al. · Microelectronic Engineering · 1997 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +12

Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Anne Jourdain, Piet De Moor, Kris Baert et al. · Journal of Micromechanics and Microengineering · 2005 · 86 citations

Engineering, Materials Engineering, Materials Science +16

Near-threshold gain mechanisms in GaN thin films in the temperature range of 20–700 K

S. Bidnyk, T. J. Schmidt, B. D. Little et al. · Applied Physics Letters · 1999 · 71 citations

Engineering, Materials Engineering, Materials Science +17

Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS

A. Modafe, Nima Ghalichechian, Michael A. Powers et al. · Microelectronic Engineering · 2005 · 58 citations

Engineering, Electrical Engineering, Materials Science +14

Packaging methodology for RF devices using a BCB membrane transfer technique

Seonho Seok, Nathalie Rolland, P-A Rolland · Journal of Micromechanics and Microengineering · 2006 · 48 citations

Engineering, Electrical Engineering, Materials Science +17