Electronic systems packaging: future reliability challenges

Lifetime estimates and unique failure mechanisms of the Digital Micromirror Device (DMD)

Michael Douglass · 1998 · 198 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +17

The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

John Parry, H.I. Rosten, G.B. Kromann · 2002 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors

John Parry, H.I. Rosten, G.B. Kromann · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17

Optically interconnected integrated circuits to solve the CMOS interconnect bottleneck

Bart Dhoedt, Roel Baets, Peter Van Daele et al. · 2002 · 20 citations

Engineering, Computer Engineering, Electrical Engineering +16

Polymer interfacial adhesion in microelectronic assemblies

Xiang Dai, M. Brillhart, Paul S. Ho · 2002 · 20 citations

Engineering, Materials Engineering, Materials Science +17