G.B. Kromann

The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

John Parry, H.I. Rosten, G.B. Kromann · 2002 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies

G.B. Kromann · 2002 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17

The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors

John Parry, H.I. Rosten, G.B. Kromann · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17

A hi-density C4/CBGA interconnect technology for a CMOS microprocessor

G.B. Kromann, Ray Gerke, Wayne Wei-Xi Huang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

G.B. Kromann · 2002 · 24 citations

Engineering, Computer Engineering, Mechanical Engineering +17