John Parry

Thermal Measurement and Modeling of Multi-Die Packages

A. Poppe, Yan Zhang, John P. Wilson et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 96 citations · Full text

The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

H.I. Rosten, Clemens Lasance, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 96 citations

Engineering, Critical Electronic Parts, Thermal Energy +18

The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods

Clemens Lasance, H.I. Rosten, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 75 citations

Numerical Analysis, Engineering, Refrigeration +21

Development, validation and application of a thermal model of a plastic quad flat pack

H.I. Rosten, John Parry, J. S. Addison et al. · 2002 · 46 citations

Engineering, Energy Efficiency, Mechanical Engineering +20

The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

John Parry, H.I. Rosten, G.B. Kromann · 2002 · 45 citations

Engineering, Energy Efficiency, Computer Architecture +21