Concepedia
Statistics
Publications
17
Citations
645
H-Index
13
Active since
1997
Affiliations
Philips (Netherlands)(Current)
Mentor
Siemens (Hungary)
Andrássy University Budapest
University of Greenwich
John Parry is an author at Philips (Netherlands) specializing in engineering, heat transfer, and thermal analysis.
Publications per year
1997–2016
Thermal Measurement and Modeling of Multi-Die Packages
A. Poppe, Yan Zhang, John P. Wilson et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 96 citations · Full text
Engineering, Electrical Engineering, Heat Transfer +16
The world of thermal characterization according to DELPHI-Part I: Background to DELPHI
H.I. Rosten, Clemens Lasance, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 96 citations
Engineering, Electrical Engineering, Systems Engineering +17
The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods
Clemens Lasance, H.I. Rosten, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 75 citations
Engineering, Physics, Heat Transfer +16
Development, validation and application of a thermal model of a plastic quad flat pack
H.I. Rosten, John Parry, J. S. Addison et al. · 2002 · 46 citations
Engineering, Materials Science, Mechanical Engineering +17
The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors
John Parry, H.I. Rosten, G.B. Kromann · 2002 · 45 citations
Engineering, Computer Engineering, Electrical Engineering +17
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