Clemens Lasance - Concepedia

Author

Clemens Lasance

Also Known As

C. J. M. Lasance, C. J.M. Lasance, C. Lasance, C.J.M Lasance, C.J.M. Lasance, Clemens J M Lasance, Clemens J. M. Lasance, Clemens J.M. Lasance, Clemens Lasance, Clemens Lasance ,

107

Publications

Citations

H-Index

Concepts

All Affiliations

Philips (Netherlands)Philips (Finland)Nokia (Finland)Siemens (Hungary)Eindhoven University of Technology

About

Clemens Lasance is an author at Philips (Netherlands) specializing in engineering, heat transfer, and thermal engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	24	31	1.3K
2	Education	3	3	69
3	Natural Sciences	2	2	114
4	Business	1	1	36
5	Social Sciences	1	1	38

Clemens Lasance

Publications

1.4K

Citations

H-Index

Page 1

	Year	Citations
A novel approach for the thermal characterization of electronic parts Clemens Lasance, H. Vinke, H.I. Rosten, EngineeringThermal BehaviourComputer ArchitectureThermal ConductivitySimple Resistance Network	2002	102
Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software Clemens Lasance, Dick den Hertog, Peter Stehouwer EngineeringHeat RecoveryEnergy EfficiencyComputer-aided DesignStructural Optimization	2003	97
The world of thermal characterization according to DELPHI-Part I: Background to DELPHI H.I. Rosten, Clemens Lasance, John Parry IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringCritical Electronic PartsThermal EnergyRefrigerationThermal Analysis	1997	96
The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods Clemens Lasance, H.I. Rosten, John Parry IEEE Transactions on Components Packaging and Manufacturing Technology Part A Numerical AnalysisEngineeringRefrigerationNumerical ComputationNumerical Simulation	1997	75
Thermal characterization of electronic devices with boundary condition independent compact models Clemens Lasance, H. Vinke, H.I. Rosten IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringComputer ArchitectureThermal ConductivitySimple Resistance NetworkPhysical Design (Electronics)	1995	74
Two benchmarks to facilitate the study of compact thermal modeling phenomena Clemens Lasance IEEE Transactions on Components and Packaging Technologies Numerical AnalysisEngineeringEnergy EfficiencyThermal EnergyRefrigeration	2001	74
On the standardization of thermal characterization of LEDs A. Poppe, Clemens Lasance EngineeringEnergy EfficiencyPower ElectronicsThermal StandardsLight-emitting Diodes	2009	66
Thermally driven reliability issues in microelectronic systems: status-quo and challenges Clemens Lasance Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2003	62
Challenges in thermal interface material testing Clemens Lasance, C. T. Murray, David L. Saums, EngineeringLaboratory Measurement MethodologyThermal ConductivityThermal AnalysisThermodynamics	2006	62
Compact models for accurate thermal characterization of electronic parts H. Vinke, Clemens Lasance IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringRefrigerationPhysical Design (Electronics)Thermal AnalysisModeling And Simulation	1997	52

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