Concepedia

Clemens Lasance

CL

33

Publications

1.4K

Citations

24

H-Index

1995

Active since

Affiliations

Philips (Netherlands)(Current)

Philips (Finland)

Nokia (Finland)

Siemens (Hungary)

Eindhoven University of Technology

Clemens Lasance is an author at Philips (Netherlands) specializing in engineering, heat transfer, and thermal engineering.

Top concepts

EngineeringHeat TransferThermal EngineeringThermodynamicsElectronic PackagingElectrical EngineeringThermal ModelingComputer EngineeringRefrigerationMicroelectronics

Publications per year

1995–2010

33

Publications

33

A novel approach for the thermal characterization of electronic parts

Clemens Lasance, H. Vinke, H.I. Rosten et al. · 2002 · 102 citations

Engineering, Thermal Behaviour, Computer Architecture +21

Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software

Clemens Lasance, Dick den Hertog, Peter Stehouwer · 2003 · 97 citations

Engineering, Heat Recovery, Energy Efficiency +22

The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

H.I. Rosten, Clemens Lasance, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 96 citations

Engineering, Critical Electronic Parts, Thermal Energy +18

The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods

Clemens Lasance, H.I. Rosten, John Parry · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 75 citations

Numerical Analysis, Engineering, Refrigeration +21

Thermal characterization of electronic devices with boundary condition independent compact models

Clemens Lasance, H. Vinke, H.I. Rosten · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 74 citations

Engineering, Computer Architecture, Thermal Conductivity +24

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