H. Vinke

A novel approach for the thermal characterization of electronic parts

Clemens Lasance, H. Vinke, H.I. Rosten et al. · 2002 · 102 citations

Engineering, Thermal Behaviour, Computer Architecture +21

Thermal characterization of electronic devices with boundary condition independent compact models

Clemens Lasance, H. Vinke, H.I. Rosten · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 74 citations

Engineering, Computer Architecture, Thermal Conductivity +24

Compact models for accurate thermal characterization of electronic parts

H. Vinke, Clemens Lasance · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 52 citations

Engineering, Refrigeration, Physical Design (Electronics) +17

Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment

H.I. Rosten, John Parry, Clemens Lasance et al. · 2002 · 38 citations

Engineering, Engineering Thermodynamics, Advanced Design +28

Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models

H. Vinke, Clemens Lasance · 2002 · 24 citations

Engineering, 'Compact Model, Thermal Conductivity +22